MiataDrivers - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Brandon Noia, Krishnendu Chakrabarty
[PDF.ph20] MiataDrivers - Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Rating: 3.56 (601 Votes)
Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty epub Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty pdf download Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty pdf file Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty audiobook Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty book review Design-for-Test and Test Optimization Brandon Noia, Krishnendu Chakrabarty summary | #5607685 in Books | 2013-11-16 | Original language:English | PDF # 1 | 9.20 x.80 x6.00l,1.45 | File type: PDF | 245 pages||From the Back Cover||This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC tes
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimizati...
You easily download any file type for your device.Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs | Brandon Noia, Krishnendu Chakrabarty. I really enjoyed this book and have already told so many people about it!
